Invention Grant
- Patent Title: Array substrate and method for repairing broken data line
- Patent Title (中): 阵列基板和修复破碎数据线的方法
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Application No.: US14568813Application Date: 2014-12-12
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Publication No.: US09595547B2Publication Date: 2017-03-14
- Inventor: Huibin Guo , Shoukun Wang , Liangliang Li , Yuchun Feng , Zongjie Guo
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg; Stanley N. Protigal
- Priority: CN201410217057 20140521
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786

Abstract:
The invention discloses an array substrate, and a method for repairing a broken data line on an array substrate. The method for repairing a broken data line on an array substrate includes steps: performing a treatment on a part of a semiconductor layer corresponding to an opening in a data line so that the part of the semiconductor layer becomes a conductive region, and the ends of the opening in the data line are electrically connected to each other by the conductive semiconductor layer. The above method for repairing a broken data line provided by the invention is not affected by the linewidth of the data line so that the broken data line can be repaired in the case that the linewidth of the data line is relatively small.
Public/Granted literature
- US20150340388A1 Array Substrate and Method for Repairing Broken Data line Public/Granted day:2015-11-26
Information query
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