Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US15188584Application Date: 2016-06-21
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Publication No.: US09595603B2Publication Date: 2017-03-14
- Inventor: Yasuhiro Hirabayashi , Masaru Senoo , Akitaka Soeno , Satoru Machida , Yusuke Yamashita
- Applicant: Toyota Jidosha Kabushiki Kaisha
- Applicant Address: JP Toyota-shi
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-shi
- Agency: Dinsmore & Shohl LLP
- Priority: JP2015-133673 20150702
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/739 ; H01L29/36 ; H01L29/10

Abstract:
A semiconductor device includes a semiconductor layer and a trench gate portion that extends toward a deep portion from a front surface of the semiconductor layer. The semiconductor layer includes an island region surrounded by the trench gate portion. A first side surface of the trench gate portion and a second side surface of the trench gate portion are in contact with the island region. A first conductivity type contact region that includes a first contact region that is in contact with the first side surface and a second contact region that is in contact with the second side surface is provided in the island region. Moreover, a second conductivity type contact region that is in contact with the trench gate portion at a position between the first contact region and the second contact region is provided in the island region.
Public/Granted literature
- US20170005186A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-01-05
Information query
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