Invention Grant
- Patent Title: Light emitting device and light emitting device package
- Patent Title (中): 发光器件和发光器件封装
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Application No.: US14619185Application Date: 2015-02-11
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Publication No.: US09595647B2Publication Date: 2017-03-14
- Inventor: Hyo Kun Son
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2009-0116993 20091130
- Main IPC: H01L29/88
- IPC: H01L29/88 ; H01L29/861 ; H01L33/58 ; H01L33/10 ; H01L33/24 ; F21V23/06 ; H01L33/32 ; H01L33/20 ; H01L33/00 ; F21Y101/02 ; H01L33/38

Abstract:
Provided is a light emitting device, which includes a second conductive type semiconductor layer, an active layer, a first conductive type semiconductor layer, and a intermediate refraction layer. The active layer is disposed on the second conductive type semiconductor layer. The first conductive type semiconductor layer is disposed on the active layer. The intermediate refraction layer is disposed on the first conductive type semiconductor layer. The intermediate refraction layer has a refractivity that is smaller than that of the first conductive type semiconductor layer and is greater than that of air.
Public/Granted literature
- US20170077365A9 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2017-03-16
Information query
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