Invention Grant
- Patent Title: Header assembly
- Patent Title (中): 标题组件
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Application No.: US14944932Application Date: 2015-11-18
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Publication No.: US09595795B2Publication Date: 2017-03-14
- Inventor: David James Lane , Jesse Alan Baker
- Applicant: TYCO ELECTRONICS CORPORATION
- Applicant Address: US PA Berwyn
- Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R24/38 ; H01R13/506 ; H01R13/645 ; H01R24/50 ; H01R103/00 ; H01R13/627 ; H01R13/6583 ; H01R24/52

Abstract:
A header assembly includes an outer housing holding a center contact and a dielectric body. The outer housing has a rear shell and an outer contact extending forward from the rear shell. The outer contact has a catch extending therefrom positioned forward of the rear shell. The header assembly includes a nose cone coupled to the outer contact. The nose cone surrounds the outer contact. The nose cone has one or more keying ribs along an exterior thereof. The nose cone has a latch engaging the catch to secure the nose cone to the outer housing in one of at least two distinct rotational orientations.
Public/Granted literature
- US20160164232A1 HEADER ASSEMBLY Public/Granted day:2016-06-09
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