Invention Grant
- Patent Title: Methods for manufacturing and operating a semiconductor device
- Patent Title (中): 制造和操作半导体器件的方法
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Application No.: US14042037Application Date: 2013-09-30
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Publication No.: US09595835B2Publication Date: 2017-03-14
- Inventor: Karl-Heinz Allers , Reiner Schwab
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Priority: DE10349557 20031022
- Main IPC: H02J7/00
- IPC: H02J7/00 ; H01L27/08

Abstract:
A method for manufacturing and operating a semiconductor device is disclosed. The semiconductor device includes a first capacitor node, a second capacitor node, a first capacitor electrode, a second capacitor electrode, a first switch and a second switch. The first switch is coupled between the first capacitor electrode and the first and second capacitor nodes such that the first switch has a first position that couples the first capacitor electrode to the first capacitor node and a second position that couples the first capacitor electrode to the second capacitor node. The second switch is coupled between the second capacitor electrode and the first and second capacitor nodes such that the second switch has a first position that couples the second capacitor electrode to the first capacitor node and a second position that couples the second capacitor electrode to the second capacitor node.
Public/Granted literature
- US20140028269A1 Methods for Manufacturing and Operating a Semiconductor Device Public/Granted day:2014-01-30
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