Invention Grant
- Patent Title: Method and apparatus for die-to-die communication
- Patent Title (中): 用于裸片到芯片通信的方法和装置
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Application No.: US15244929Application Date: 2016-08-23
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Publication No.: US09596008B2Publication Date: 2017-03-14
- Inventor: Subhashish Mukherjee , Venugopal Gopinathan
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Michael A. Davis, Jr.; Charles A. Brill; Frank D. Cimino
- Priority: IN2345/CHE/2013 20130529
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H01L23/66 ; H03B5/08
Abstract:
In apparatus for die-to-die communication, a first die includes at least a first circuit, and a second die includes at least a second circuit. The first die is separated by a fixed distance from the second die. In response to a signal, the first circuit is configured to induce a current in the second circuit via a magnetic coupling between the first circuit and the second circuit.
Public/Granted literature
- US20160359528A1 METHOD AND APPARATUS FOR DIE-TO-DIE COMMUNICATION Public/Granted day:2016-12-08
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