Invention Grant
US09596758B2 Pattern forming method, electronic wiring substrate, and optical device
有权
图案形成方法,电子布线基板和光学装置
- Patent Title: Pattern forming method, electronic wiring substrate, and optical device
- Patent Title (中): 图案形成方法,电子布线基板和光学装置
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Application No.: US14665455Application Date: 2015-03-23
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Publication No.: US09596758B2Publication Date: 2017-03-14
- Inventor: Takeichi Tatsuta
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM CORPORATION
- Current Assignee: FUJIFILM CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2012-211762 20120926
- Main IPC: H05K3/12
- IPC: H05K3/12 ; B05D5/00 ; H05K1/09 ; B41J2/01 ; H05K1/02

Abstract:
A pattern forming method of ejecting inks in the form of droplets to a base material including a first region and a second region which differ from each other in terms of surface energy by an ink jet method, includes: a preparation step of preparing the base material including the first region and the second region; and a droplet ejection step of simultaneously ejecting a first ink and a second ink in the form of droplets to the first region and the second region respectively by using a multipass method, wherein the inks are at least two kinds of inks including the first ink having volatility and the second ink having curability, the first ink and the first region are lyophilic, and the second ink and the second region are lyophilic.
Public/Granted literature
- US20150201491A1 PATTERN FORMING METHOD, ELECTRONIC WIRING SUBSTRATE, OPTICAL DEVICE, AND PATTERN FORMING APPARATUS Public/Granted day:2015-07-16
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