Invention Grant
- Patent Title: Method of fabricating a circuit board
- Patent Title (中): 制造电路板的方法
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Application No.: US13365115Application Date: 2012-02-02
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Publication No.: US09596762B2Publication Date: 2017-03-14
- Inventor: Seung Hun Hong , Min Baek Lee
- Applicant: Seung Hun Hong , Min Baek Lee
- Applicant Address: KR Seoul
- Assignee: SNU R&DB FOUNDATION
- Current Assignee: SNU R&DB FOUNDATION
- Current Assignee Address: KR Seoul
- Agency: Dorsey & Whitney LLP
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; H05K1/16 ; B82Y10/00 ; H05K3/12

Abstract:
Example methods of fabricating a circuit board are disclosed. An example method includes providing a substrate, forming at least one or more channels having linear nanostructures on the substrate, and forming a first electrode and a second electrode on the substrate, where the at least one or more channels electrically couple the first electrode to the second electrode.
Public/Granted literature
- US20120135136A1 CIRCUIT BOARD INCLUDING ALIGNED NANOSTRUCTURES Public/Granted day:2012-05-31
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