Invention Grant
- Patent Title: Electronic component, method of manufacturing electronic component, and electronic device
- Patent Title (中): 电子部件，电子部件的制造方法以及电子设备
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Application No.: US14725235Application Date: 2015-05-29
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Publication No.: US09596767B2Publication Date: 2017-03-14
- Inventor: Aki Dote
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2014-129060 20140624
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H05K3/28 ; H05K1/11 ; H05K3/34 ; H05K3/40
Abstract:
An electronic component includes: a substrate; wiring provided on the substrate, and including an uneven section at an edge portion of the wiring in plain view; and an insulating film provided on the substrate and on the wiring.And a method of manufacturing an electronic component includes: forming, on a substrate, wiring including an uneven section at an edge portion of the wiring in plain view; and forming an insulating film on the substrate and on the wiring.
Public/Granted literature
- US20150373850A1 ELECTRONIC COMPONENT, METHOD OF MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE Public/Granted day:2015-12-24
Information query
IPC分类:
