An element housing package is provided with: a base plate including, on a top surface, a mounting region for mounting an element; a frame body disposed on the top surface of the base plate so as to surround the mounting region, the frame body including a through-hole; a connector disposed so as to pass through the through-hole T of the frame body and to extend from the inside to the outside of the frame body; a pedestal member disposed on the top surface of the base plate so as to be positioned in the frame body; and a wiring base plate bonded to a top surface of the pedestal member with a first bonding material placed therebetween and connected to the connector.