Methods of applying aluminum coating layers over copper wires are disclosed. A first method may include applying aluminum powder to the surface of a rod, passing the rod through a first set of compression rolls thereby forcing the aluminum powder into a compacted preform around the rod, and heating the rod covered by the preform at 550° C. to 620° C. Further, the heated preform coated rod is passed through a second set of compression rolls thereby obtaining an aluminum coated copper rod. A second method includes disposing a copper rod inside an aluminum tube having an inner layer formed of brazing aluminum alloy, reducing the diameter of the tube's inner surface to match the copper rod, and heating the composite tube-rod such that the inner layer of the brazing alloy fuses to the rod. Another method includes passing the copper rod through a spray of metallic aluminum.