Invention Grant
- Patent Title: Method for producing a hole with side-delimiting flanks in a component
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Application No.: US12381835Application Date: 2009-03-17
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Publication No.: US09597751B2Publication Date: 2017-03-21
- Inventor: Hans-Thomas Bolms , Jan Münzer , Thomas Podgorski , Lutz Wolkers
- Applicant: Hans-Thomas Bolms , Jan Münzer , Thomas Podgorski , Lutz Wolkers
- Applicant Address: DE München
- Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee Address: DE München
- Priority: EP08006084 20080328
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/384 ; B23K26/382 ; B23K101/00
Abstract:
A method for producing a hole with side-delimiting flanks in a component using a laser beam is provided. A laser beam is directed onto the component. A side flank of the hole is traced with the laser beam. A partial volume of the hole is formed by vaporizing the component material. This is repeated until the whole volume is formed. The laser beam may be oriented so that it includes an angle of more than 8° with the traced side flank.
Public/Granted literature
- US20090283508A1 Method for producting a hole Public/Granted day:2009-11-19
Information query
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