Invention Grant
- Patent Title: Method of fabricating a polishing
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Application No.: US14550129Application Date: 2014-11-21
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Publication No.: US09597770B2Publication Date: 2017-03-21
- Inventor: William C. Allison , Diane Scott , Rajeev Bajaj
- Applicant: NexPlanar Corporation
- Applicant Address: US OR Hillsboro
- Assignee: NexPlanar Corporation
- Current Assignee: NexPlanar Corporation
- Current Assignee Address: US OR Hillsboro
- Agent Thomas Omholt; Erika Wilson; Justin Brask
- Main IPC: B24D18/00
- IPC: B24D18/00 ; B24B37/20 ; B24B37/22 ; B24B37/26 ; B24B37/005 ; B24B49/12
Abstract:
Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.
Public/Granted literature
- US20150079878A1 POLISHING PAD WITH APERTURE Public/Granted day:2015-03-19
Information query
