Invention Grant
- Patent Title: Carrier head having retainer ring, polishing system including the carrier head and method of using the polishing system
-
Application No.: US14134091Application Date: 2013-12-19
-
Publication No.: US09597771B2Publication Date: 2017-03-21
- Inventor: Chang-Sheng Lin , Hsin-Hsien Lu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: B24B37/32
- IPC: B24B37/32 ; B24B37/30
Abstract:
A carrier head includes a housing configured to enclose a wafer, wherein the housing includes a retaining ring recess. The carrier head includes a retaining ring positioned in the retaining ring recess, the retaining ring configured to surround the wafer. The retaining ring has a hardness ranging from about 5 shore A to about 80 shore D. A method of using a polishing system includes securing a wafer in a carrier head. The carrier head includes a housing enclosing the wafer, wherein the housing includes a retaining ring recess. The carrier head includes a retaining ring in the retaining ring recess. The retaining ring has a hardness ranging from about 5 shore A to about 80 shore D. The method includes pressing the wafer against a polishing pad, and moving at least one of the carrier head or the polishing pad relative to the other.
Public/Granted literature
Information query
