Invention Grant
- Patent Title: Homogeneous polishing pad for eddy current end-point detection
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Application No.: US14152792Application Date: 2014-01-10
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Publication No.: US09597777B2Publication Date: 2017-03-21
- Inventor: William C. Allison , Diane Scott , Ping Huang , Richard Frentzel , Alexander William Simpson
- Applicant: NexPlanar Corporation
- Applicant Address: US OR Hillsboro
- Assignee: NexPlanar Corporation
- Current Assignee: NexPlanar Corporation
- Current Assignee Address: US OR Hillsboro
- Agent Thomas Omholt; Erika Wilson; Justin K. Brask
- Main IPC: B24D11/00
- IPC: B24D11/00 ; B24B37/013 ; B24B37/20
Abstract:
Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.
Public/Granted literature
- US20140123563A1 HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION Public/Granted day:2014-05-08
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