Invention Grant
- Patent Title: Method for cutting high-hardness material by multi-wire saw
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Application No.: US14423471Application Date: 2013-08-30
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Publication No.: US09597819B2Publication Date: 2017-03-21
- Inventor: Sadahiko Kondo , Akira Miyachi , Toshihiko Hatanaka
- Applicant: HITACHI METALS, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI METALS, LTD.
- Current Assignee: HITACHI METALS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Keating & Bennett, LLP
- Priority: JP2012-193150 20120903
- International Application: PCT/JP2013/073292 WO 20130830
- International Announcement: WO2014/034841 WO 20140306
- Main IPC: B28D5/04
- IPC: B28D5/04 ; B28D1/08 ; B23D61/18 ; B23D57/00

Abstract:
This method of cutting a high-hardness material with a multi-wire saw includes the steps of: (A) providing at least one ingot which includes a body portion 10a with two ends and a low-quality crystal portion 10e that is located at only one of the two ends of the body portion; (B) fixing the at least one ingot onto a fixing base; and (C) slicing the at least one ingot by moving the ingot with respect to a saw wire so that the saw wire does not contact with the low-quality crystal portion 10e of the at least one ingot but does contact with its body portion 10a.
Public/Granted literature
- US20150183132A1 METHOD FOR CUTTING HIGH-HARDNESS MATERIAL BY MULTI-WIRE SAW Public/Granted day:2015-07-02
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