Invention Grant
- Patent Title: Three-dimensional modeling apparatus, model, and method of manufacturing a model
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Application No.: US14812766Application Date: 2015-07-29
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Publication No.: US09597835B2Publication Date: 2017-03-21
- Inventor: Hiroyuki Yasukochi
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: DENTONS US LLP
- Priority: JP2011-108989 20110516
- Main IPC: B29C67/00
- IPC: B29C67/00 ; B29L31/00 ; B33Y10/00

Abstract:
A three-dimensional modeling apparatus includes: a stage; a regulating body having a surface including a linear region along a first direction and being arranged to face the stage so that the linear region of the surface comes closest to the stage; a supply nozzle configured to supply a material to be cured by energy of an energy beam to a slit region which is a region between the stage and the linear region; a movement mechanism configured to move the regulating body and the stage relative to each other along a second direction other than the first direction to form a cured layer of the material for at least one layer; and an irradiation unit configured to irradiate the material supplied from the supply nozzle to the slit region with the energy beam under a state in which the stage and the regulating body rest relative to each other.
Public/Granted literature
- US20150328832A1 THREE-DIMENSIONAL MODELING APPARATUS, MODEL, AND METHOD OF MANUFACTURING A MODEL Public/Granted day:2015-11-19
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