Invention Grant
- Patent Title: Writing instrument or applicator having resin molded parts
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Application No.: US14467516Application Date: 2014-08-25
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Publication No.: US09597920B2Publication Date: 2017-03-21
- Inventor: Kei Oomoto , Yumi Maejima , Daisaku Morimoto , Kyo Nakayama
- Applicant: MITSUBISHI PENCIL COMPANY, LIMITED
- Applicant Address: JP Shaingawa-ku
- Assignee: MITSUBISHI PENCIL COMPANY, LIMITED
- Current Assignee: MITSUBISHI PENCIL COMPANY, LIMITED
- Current Assignee Address: JP Shaingawa-ku
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2013-182186 20130903; JP2014-142300 20140710
- Main IPC: B43K21/22
- IPC: B43K21/22 ; B43K7/12 ; B43K8/02 ; B43K8/04 ; B43K21/00 ; B43K21/16 ; B43K23/008 ; B43K24/08 ; B43K25/02 ; B43K29/00 ; B43K29/02 ; B43L19/00 ; B29C45/16 ; A45D34/04 ; B29L31/00

Abstract:
Provided is a writing instrument or an applicator using resin parts formed, by way of two-color molding, to have an optimal guiding clearance between slide members. A plurality of resin molded parts is included. At least one of the plurality of resin molded parts is formed as a primary molding, and at least another one of the resin molded parts is formed as a secondary molding, by way of two-color molding, using a portion of a surface of the primary molding. The primary molding and the secondary molding are separated to be used as independent members. In this case, the primary molding and the secondary molding are preferably configured to slide against each other by each separating portion.
Public/Granted literature
- US20150063893A1 WRITING INSTRUMENT OR APPLICATOR HAVING RESIN MOLDED PARTS Public/Granted day:2015-03-05
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