Invention Grant
- Patent Title: Packaging having a surrounding heat barrier
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Application No.: US14113131Application Date: 2012-04-23
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Publication No.: US09598221B2Publication Date: 2017-03-21
- Inventor: Nico Ros , Richard Ettl
- Applicant: Nico Ros , Richard Ettl
- Applicant Address: CH Zug
- Assignee: REP IP AG
- Current Assignee: REP IP AG
- Current Assignee Address: CH Zug
- Agency: Fitch, Even, Tabin & Flannery LLP
- Priority: ATA572/2011 20110421
- International Application: PCT/AT2012/000110 WO 20120423
- International Announcement: WO2012/142639 WO 20121026
- Main IPC: B65D81/38
- IPC: B65D81/38 ; B32B3/02 ; F28D20/02 ; B32B15/04 ; E04B1/80 ; E04B1/74 ; E04B1/76 ; F28D20/00 ; F25D3/06
Abstract:
In an insulating element (1) for bounding spaces to be thermally insulated, e.g. for transport or packaging containers, comprising an in particular plate-shaped substrate element (2) made of a material having a low thermal conductivity, such as a polymer, the substrate element (2) is provided with a metallic coating (3) having a low emissivity in order to reduce the thermal radiation, yet is applied in a layer thickness of
Public/Granted literature
- US20140117026A1 Packaging having a surrounding heat barrier Public/Granted day:2014-05-01
Information query
