Invention Grant
- Patent Title: Pressure sensor and manufacture method thereof
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Application No.: US14596967Application Date: 2015-01-14
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Publication No.: US09598275B2Publication Date: 2017-03-21
- Inventor: Yu-Hao Chien , Li-Tien Tseng
- Applicant: MiraMEMS Sensing Technology Co., Ltd.
- Applicant Address: CN Suzhou
- Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTD
- Current Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTD
- Current Assignee Address: CN Suzhou
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW103121910A 20140625
- Main IPC: B81B7/02
- IPC: B81B7/02 ; B81C1/00 ; H01L23/10 ; B81B7/00

Abstract:
A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the surface between the first substrate and the second substrate and further breaks out the surface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber. The manufacture method of the pressure sensor is also disclosed.
Public/Granted literature
- US20150375994A1 PRESSURE SENSOR AND MANUFACTURE METHOD THEREOF Public/Granted day:2015-12-31
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