A device in which an electronic circuit positioned within a cavity of a package housing is encased by a bubble restrictor material, with a media resistant material overlaying the bubble restrictor material. The bubble restrictor material functions to inhibit the formation and growth of moisture-related bubbles within the material, including at the interfaces of the material and surfaces within the package housing. The media resistant material is resistant to physical and chemical alterations by media within an external environment to which the device is exposed. The media resistant material and bubble resistant material function to transfer a sensed characteristic of the media to the electronic circuit.