Invention Grant
- Patent Title: Silver powder for silver clay and silver clay including same silver powder
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Application No.: US13731747Application Date: 2012-12-31
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Publication No.: US09598561B2Publication Date: 2017-03-21
- Inventor: Shinji Otani , Yoshifumi Yamamoto , Takashi Yamaji
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2012-002339 20120110
- Main IPC: C08L1/28
- IPC: C08L1/28 ; B22F1/00 ; B22F9/08
Abstract:
A silver powder for silver clay, wherein a main component is Ag, and an amount of P is controlled to be 100 ppm or less.
Public/Granted literature
- US20130213261A1 SILVER POWDER FOR SILVER CLAY AND SILVER CLAY INCLUDING SAME SILVER POWDER Public/Granted day:2013-08-22
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