Invention Grant
- Patent Title: Curable resin composition, resin composition, resin sheet formed by using said curable resin composition and resin composition, and cured materials thereof
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Application No.: US14405810Application Date: 2013-06-07
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Publication No.: US09598573B2Publication Date: 2017-03-21
- Inventor: Yuichiro Deguchi , Takahiro Mori , Yoshihiro Fukuda , Takeru Ohtsu
- Applicant: ADEKA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Adeka Corporation
- Current Assignee: Adeka Corporation
- Current Assignee Address: JP Tokyo
- Agency: Millen White Zelano & Branigan, P.C.
- Priority: JP2012-130698 20120608
- International Application: PCT/JP2013/003603 WO 20130607
- International Announcement: WO2013/183303 WO 20131212
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L79/04 ; C08G59/32 ; C08G59/40 ; C08G59/50 ; C08J5/18 ; C08J7/04

Abstract:
A curable resin composition which comprising (A), (B) and (C) as follows: (A) 100 parts by mass of polyfunctional epoxy component which contains (A1) a trifunctional epoxy compound having three glycidyl groups in a molecule and (A2) a tetrafunctional epoxy compound having four glycidyl groups in a molecule, wherein (A1):(A2) is 10:90 to 90:10 in terms of mass; (B) 25 to 200 parts by mass of a cyanic acid ester compound having two or more of cyanato groups; and (C) 0.5 to 20 parts by mass of an imidazole compound as a curing agent.
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