Invention Grant
- Patent Title: High temperature stable thermally conductive materials
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Application No.: US13990446Application Date: 2012-01-10
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Publication No.: US09598575B2Publication Date: 2017-03-21
- Inventor: Dorab Bhagwagar , Kelly Messing , Elizabeth Wood
- Applicant: Dorab Bhagwagar , Kelly Messing , Elizabeth Wood
- Applicant Address: US MI Midland
- Assignee: DOW CORNING CORPORATION
- Current Assignee: DOW CORNING CORPORATION
- Current Assignee Address: US MI Midland
- Agency: Howard & Howard Attorneys PLLC
- International Application: PCT/US2012/020699 WO 20120110
- International Announcement: WO2012/102852 WO 20120802
- Main IPC: C08L83/04
- IPC: C08L83/04 ; C08K5/3417 ; C08K5/00 ; C08K5/34 ; F28F23/00 ; C08K3/22 ; C08K3/28 ; C08K3/04 ; C08K3/14 ; C09K5/14 ; C08G77/12 ; C08G77/20 ; C08K3/00 ; C08K5/3467 ; C08K5/56
Abstract:
Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
Public/Granted literature
- US20130248163A1 High Temperature Stable Thermally Conductive Materials Public/Granted day:2013-09-26
Information query
