Invention Grant
- Patent Title: Method of cutting target members using a cutting saw device
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Application No.: US14868866Application Date: 2015-09-29
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Publication No.: US09599253B1Publication Date: 2017-03-21
- Inventor: Galen R. Clark, II
- Applicant: TETRA TECHNOLOGIES, INC.
- Applicant Address: US TX The Woodlands
- Assignee: TETRA Technologies, Inc.
- Current Assignee: TETRA Technologies, Inc.
- Current Assignee Address: US TX The Woodlands
- Agency: Garvey, Smith, Nehrbass & North LLC
- Agent Brett A. North
- Main IPC: E03F3/06
- IPC: E03F3/06 ; F16L1/16 ; B23D57/00 ; E21B29/00
Abstract:
A diamond wire saw and method provides a frame that includes a clamp that attaches to a target (e.g. piling, beam, tubular), an elongated toothed rack extending away from the mount and target, and a moving portion that carries the diamond wire and motor drives that advance the moving portion toward the target and along the toothed rack while driving the wire around roller guides.
Information query
