An apparatus includes a first interface platform and a second interface platform. One interface platform is configured to be coupled to a support structure, and the other interface platform is configured to be coupled to a device that operates at a temperature different than a temperature of the support structure. The apparatus also includes at least one intermediate stage platform and struts connecting the first and second interface platforms to the at least one intermediate stage platform. Top surfaces of the interface platforms may be substantially coplanar. At least a portion of the second interface platform can reside within an opening of the first interface platform. The struts can be arranged in a nested configuration having first and second sets of struts, where the second set is located within the first set. Each strut in the first set could be substantially parallel to an adjacent strut in the second set.