Invention Grant
- Patent Title: Heat pump apparatus
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Application No.: US14425915Application Date: 2013-05-16
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Publication No.: US09599377B2Publication Date: 2017-03-21
- Inventor: Yohei Kato
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: WOPCT/JP2012/076007 20121005
- International Application: PCT/JP2013/063731 WO 20130516
- International Announcement: WO2014/054310 WO 20140410
- Main IPC: F25B27/00
- IPC: F25B27/00 ; F24D12/02 ; F25B49/02 ; F24D15/04 ; F25B30/02 ; F25B30/06 ; B29C43/02 ; B29C43/18 ; B29C70/46 ; B29C70/12 ; B29C70/40 ; B29C70/30 ; B29C70/42 ; B29K101/12 ; B29K105/08 ; B29K77/00 ; B29K307/04 ; B29K309/08

Abstract:
Provided is a heat pump device configured to collect heat both from outside air and another heat source. A controller calculates heat exchange amounts with use of heat exchange performance of each of an air heat-source heat exchanger and an underground heat-source heat exchanger in addition to an outside air temperature and an underground temperature. Then, in switching between a simultaneous operation of causing refrigerant to flow through both of the air heat-source heat exchanger and the underground heat-source heat exchanger and a single operation of selecting the air heat-source heat exchanger or the underground heat-source heat exchanger to cause refrigerant to flow therethrough, the controller selects a heat source having a larger calculated heat exchange amount. In this manner, an appropriate heat source suitable for operation conditions can be selected.
Public/Granted literature
- US20150219370A1 HEAT PUMP APPARATUS Public/Granted day:2015-08-06
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