- Patent Title: Semiconductor packages and data storage devices including the same
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Application No.: US14499629Application Date: 2014-09-29
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Publication No.: US09599516B2Publication Date: 2017-03-21
- Inventor: EungChang Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Ward and Smith, P.A.
- Priority: KR10-2014-0028456 20140311
- Main IPC: H01L23/48
- IPC: H01L23/48 ; G01K7/16 ; H01L25/18 ; G11C7/04 ; G01K7/02 ; G01L1/22 ; H01L25/10 ; H01L21/66 ; G11C5/04 ; G01B7/16 ; H01L23/31 ; H01L23/58 ; H01L23/00 ; H01L25/065
Abstract:
A semiconductor package includes a package substrate having first connecting pads and second connecting pads, and a semiconductor chip mounted on the package substrate. The semiconductor chip includes a semiconductor device comprising a semiconductor substrate and electrically connected to input/output (I/O) pads, and a measuring device formed on the semiconductor device and electrically connected to measuring pads. The I/O pads are electrically connected to the first connecting pads, and the measuring pads are electrically connected to the second connecting pads.
Public/Granted literature
- US20150262708A1 SEMICONDUCTOR PACKAGES AND DATA STORAGE DEVICES INCLUDING THE SAME Public/Granted day:2015-09-17
Information query
IPC分类:
