Invention Grant
- Patent Title: Circuit and method for monolithic stacked integrated circuit testing
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Application No.: US14030684Application Date: 2013-09-18
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Publication No.: US09599670B2Publication Date: 2017-03-21
- Inventor: Sandeep Kumar Goel
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Ltd
- Current Assignee: Taiwan Semiconductor Manufacturing Company Ltd
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G01R31/3185
- IPC: G01R31/3185 ; G01R31/28 ; G01R31/317

Abstract:
A monolithic stacked integrated circuit (IC) is provided with a known-good-layer (KGL) path delay test circuit and at least a portion of a critical path in one of its layers. The test circuit includes a plurality of inputs, outputs, a flip-flop coupled to the at least a portion of the critical path and a multiplexer coupled to the flip-flop and to a second layer of the IC. The test circuit further includes a control element such that path delay testing of the IC may be conducted on a layer-by-layer basis.
Public/Granted literature
- US20150077147A1 Circuit And Method For Monolithic Stacked Integrated Circuit Testing Public/Granted day:2015-03-19
Information query
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