Invention Grant
- Patent Title: Link power management in an I/O interconnect
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Application No.: US14506465Application Date: 2014-10-03
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Publication No.: US09600060B2Publication Date: 2017-03-21
- Inventor: Bradley Saunders , Krishnan Ravichandran
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: G06F1/26
- IPC: G06F1/26 ; G06F3/00 ; G06F1/32 ; G06F13/42

Abstract:
Described are embodiments of methods, apparatuses, and systems for link power management in an I/O interconnect. An apparatus for link power management in an I/O interconnect of a computer apparatus may include a switching fabric having a first switch and a second switch, configured to simultaneously transport first data packets over a first path of a link between a port of the first switch and a port of the second switch and second data packets over a second path of the link. The apparatus may include a power management unit configured to modify a power state of the port of the first switch based at least in part on relative power states of the first path and the second path. Other embodiments may be described and claimed.
Public/Granted literature
- US20150113307A1 LINK POWER MANAGEMENT IN AN I/O INTERCONNECT Public/Granted day:2015-04-23
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