Invention Grant
- Patent Title: IC card substrate and fitted IC card
-
Application No.: US14722352Application Date: 2015-05-27
-
Publication No.: US09600757B2Publication Date: 2017-03-21
- Inventor: Akira Komatsu
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Baker Botts L.L.P.
- Priority: JP2014-109473 20140527
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077
Abstract:
An IC card substrate according to an embodiment is provided with a main body with a rectangular plate shape, a recessed portion which is provided on the main body, and in which an IC card having an IC chip and a contact pattern is to be fitted, and a groove portion which is provided on the main body and ranges from the recessed portion to a side of the main body.
Public/Granted literature
- US20150347893A1 IC CARD SUBSTRATE AND FITTED IC CARD Public/Granted day:2015-12-03
Information query
