Invention Grant
- Patent Title: Low temperature adhesive resins for wafer bonding
-
Application No.: US15077113Application Date: 2016-03-22
-
Publication No.: US09601364B2Publication Date: 2017-03-21
- Inventor: Robert D. Allen , Paul S. Andry , Jeffrey D. Gelorme , Li-wen Hung , John U. Knickerbocker , Cornelia K. Tsang
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Louis J. Percello
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/34 ; H01L21/683 ; H01L25/03 ; H01L21/762 ; H01L23/00 ; H01L21/463 ; H01L21/306 ; H01L21/304 ; H01L21/768
Abstract:
A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
Public/Granted literature
- US20160204015A1 LOW TEMPERATURE ADHESIVE RESINS FOR WAFER BONDING Public/Granted day:2016-07-14
Information query
IPC分类:
