Invention Grant
- Patent Title: Cavity package with die attach pad
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Application No.: US14250869Application Date: 2014-04-11
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Publication No.: US09601413B2Publication Date: 2017-03-21
- Inventor: Chun Ho Fan
- Applicant: Ubotic Company Limited
- Applicant Address: CN Hong Kong
- Assignee: UBOTIC COMPANY LIMITED
- Current Assignee: UBOTIC COMPANY LIMITED
- Current Assignee Address: CN Hong Kong
- Agency: Keating and Bennett, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/495 ; H01L23/057 ; H01L21/50 ; H01L21/56

Abstract:
A cavity package is provided. The package can include a metal leadframe and a substrate attached to an interposer formed as part of the leadframe. The substrate typically has a coefficient of thermal expansion matched to the coefficient of thermal expansion of a semiconductor device to be affixed to the substrate. The semiconductor device is typically attached to an exposed top surface of the substrate. The cavity package also includes a plastic portion molded to the leadframe forming a substrate cavity. The substrate cavity allows access to the exposed top surface of the substrate for affixing the semiconductor device. The cavity package also include a connective element for grounding a lid through an electrical path from the lid to the interposer.
Public/Granted literature
- US20140306333A1 CAVITY PACKAGE WITH DIE ATTACH PAD Public/Granted day:2014-10-16
Information query
IPC分类: