An apparatus including a die including a first side and an opposite second side including a device side with contact points and lateral sidewalls defining a thickness of the die; a primary core adjacent at least a pair of the lateral sidewalls of the die; and a build-up carrier coupled to the second side of the die, the build-up carrier including a plurality of alternating layers of conductive material and insulating material, wherein at least one of the layers of conductive material is coupled to one of the contact points of the die. A method of forming a package and an apparatus including a computing device including a package are also disclosed.