Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
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Application No.: US14504805Application Date: 2014-10-02
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Publication No.: US09601430B2Publication Date: 2017-03-21
- Inventor: Rueijer Lin , Chen-Yuan Kao , Chun-Chieh Lin , Huang-Yi Huang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsin-chu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L21/288
- IPC: H01L21/288 ; H01L23/532 ; H01L23/485 ; H01L21/768

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate. The semiconductor device structure includes a dielectric layer positioned on the semiconductor substrate. The dielectric layer has a first recess. The semiconductor device structure includes a conductive structure filling the first recess. The conductive structure includes a first conductive layer and a second conductive layer. The first conductive layer is positioned over an inner wall and a bottom of the first recess. The first conductive layer has a second recess in the first recess. The second conductive layer fills the second recess. The first conductive layer and the second conductive layer include cobalt. The second conductive layer further includes at least one of sulfur, chlorine, boron, phosphorus, or nitrogen.
Public/Granted literature
- US20160099216A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2016-04-07
Information query
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