Invention Grant
- Patent Title: Manufacturing method of array substrate
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Application No.: US15133737Application Date: 2016-04-20
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Publication No.: US09601528B2Publication Date: 2017-03-21
- Inventor: Pengju Zhang , Xiaojian Du , Bo Gao , Han Ye
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Nath, Goldberg & Meyer
- Agent Joshua B. Goldberg
- Priority: CN201510309946 20150608
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/027 ; H01L21/311 ; H01L21/02 ; H01L29/51 ; H01L29/423

Abstract:
The present invention provides a manufacturing method of an array substrate, comprising steps of: forming a gate and a gate line on a substrate; forming a gate insulating layer on the gate and the gate line; forming a pixel electrode on the gate insulating layer; and forming a first connecting via in a portion of the gate insulating layer in a non-display region and corresponding to the gate line, wherein the first connecting via is configured to connect a scanning signal trace to the gate line.
Public/Granted literature
- US20160358953A1 MANUFACTURING METHOD OF ARRAY SUBSTRATE Public/Granted day:2016-12-08
Information query
IPC分类: