Invention Grant
- Patent Title: Nanowire fabrication method and structure thereof
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Application No.: US14504488Application Date: 2014-10-02
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Publication No.: US09601571B2Publication Date: 2017-03-21
- Inventor: Martin Christopher Holland , Georgios Vellianitis , Matthias Passlack
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/20 ; H01L21/02

Abstract:
A method of providing an out-of-plane semiconductor structure and a structure fabricated thereby is disclosed. The method comprises acts of: providing a substrate defining a major surface; providing a template layer having a predetermined template thickness on the major surface of the substrate; forming a recess in the template layer having a recess pattern and a recess depth smaller than the template thickness; and epitaxially growing a semiconductor structure from the recess. A planar shape of the recess pattern formed in the template layer substantially dictates an extending direction of the semiconductor structure.
Public/Granted literature
- US20160099312A1 NANOWIRE FABRICATION METHOD AND STRUCTURE THEREOF Public/Granted day:2016-04-07
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