Invention Grant
- Patent Title: Method of manufacturing a fin-like field effect transistor (FinFET) device
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Application No.: US14447223Application Date: 2014-07-30
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Publication No.: US09601598B2Publication Date: 2017-03-21
- Inventor: Tsu-Hsiu Perng , Chih Chieh Yeh , Tzu-Chiang Chen , Chia-Cheng Ho , Chih-Sheng Chang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L29/165 ; H01L29/78 ; H01L21/02 ; H01L21/306 ; H01L29/161

Abstract:
A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary FinFET device includes a semiconductor substrate; a fin structure disposed over the semiconductor substrate; and a gate structure disposed over a portion of the fin structure. The gate structure traverses the fin structure and separates a source region and a drain region of the fin structure, the source and drain region defining a channel therebetween. The source and drain region of the fin structure include a strained source and drain feature. The strained source feature and the strained drain feature each include: a first portion having a first width and a first depth; and a second portion disposed below the first portion, the second portion having a second width and a second depth. The first width is greater than the second width, and the first depth is less than the second depth.
Public/Granted literature
- US20150031182A1 METHOD OF MANUFACTURING A FIN-LIKE FIELD EFFECT TRANSISTOR (FINFET) DEVICE Public/Granted day:2015-01-29
Information query
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