Invention Grant
- Patent Title: Aspect ratio for semiconductor on insulator
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Application No.: US14795482Application Date: 2015-07-09
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Publication No.: US09601599B2Publication Date: 2017-03-21
- Inventor: Effendi Leobandung
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Louis J. Percello
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L27/088 ; H01L29/66 ; H01L29/417 ; H01L27/12 ; H01L21/8234

Abstract:
A method comprises forming one or more fins in a first region on an insulated substrate. The method also comprises forming one or more fins formed in a second region on the insulated substrate. The insulated substrate comprising a silicon substrate, and an insulator layer deposited on the silicon substrate. The one or more fins in the first region comprising a first material layer deposited on the insulator layer. The one or more fins in the second region comprising a second material layer deposited on the insulator layer.
Public/Granted literature
- US20160351664A1 ASPECT RATIO FOR SEMICONDUCTOR ON INSULATOR Public/Granted day:2016-12-01
Information query
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