Invention Grant
- Patent Title: Structure for a gallium nitride (GaN) high electron mobility transistor
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Application No.: US14540250Application Date: 2014-11-13
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Publication No.: US09601608B2Publication Date: 2017-03-21
- Inventor: Ming-Wei Tsai , King-Yuen Wong , Han-Chin Chiu , Sheng-de Liu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/778 ; H01L29/20 ; H01L29/417 ; H01L29/10

Abstract:
A high-electron mobility transistor (HEMT) device employing a gate protection layer is provided. A substrate has a channel layer arranged over the substrate and has a barrier layer arranged over the channel layer. The channel and barrier layers define a heterojunction, and a gate structure is arranged over a gate region of the barrier layer. The gate structure includes a gate arranged over a cap, where the cap is disposed on the barrier layer. The gate protection layer is arranged along sidewalls of the cap and arranged below the gate between opposing surfaces of the gate and the cap. Advantageously, the gate protection layer passivates the gate, reduces leakage current along sidewalls of the cap, and improves device reliability and threshold voltage uniformity. A method for manufacturing the HEMT device is also provided.
Public/Granted literature
- US20160141404A1 STRUCTURE FOR A GALLIUM NITRIDE (GaN) HIGH ELECTRON MOBILITY TRANSISTOR Public/Granted day:2016-05-19
Information query
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