A microwave circuit with which cracks in substrates can be suppressed and which can reduce the size of module including the microwave circuit is provided. The microwave circuit includes a multilayer first substrate, a second substrate that opposes the first substrate, a plurality of first electrically conductive members that electrically connect a first layer of the first substrate and the second substrate to each other, a plurality of second electrically conductive members that electrically connect the first layer of the first substrate and another layer of the first substrate to each other and each of the plurality of second electrically conductive members has a smaller diameter than that of each of the first electrically conductive members, and transmission lines that connect the first electrically conductive members and the second electrically conductive members. In the microwave circuit, the plurality of first electrically conductive members and the plurality of second electrically conductive members are alternately disposed along an end portion of the first substrate.