Invention Grant
- Patent Title: Tie-off circuit with output node isolation for protection from electrostatic discharge (ESD) damage
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Application No.: US14142607Application Date: 2013-12-27
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Publication No.: US09601921B2Publication Date: 2017-03-21
- Inventor: Chen Guo , Yutaka Nakamura , Jun Sawada
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Sherman IP LLP
- Agent Kenneth L. Sherman; Steven Laut
- Main IPC: H02H9/04
- IPC: H02H9/04 ; H03K3/353 ; H01L27/088

Abstract:
Embodiments relate to electrostatic discharge (ESD) protection. One embodiment includes a tie-off circuit including a multiple field effect transistors (FETs), a first internal node, a second internal node, a first output node and a second output node. A node isolation circuit is connected to the first output node and the second output node of the tie-off circuit. The node isolation circuit includes a first FET with a third output node and a second FET with a fourth output node. The third output node and the fourth output node are electrically isolated from the first internal node and the second internal node.
Public/Granted literature
- US20150188313A1 TIE-OFF CIRCUIT WITH OUTPUT NODE ISOLATION FOR PROTECTION FROM ELECTROSTATIC DISCHARGE (ESD) DAMAGE Public/Granted day:2015-07-02
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