There is provided a heat dissipating substrate including: a base substrate having a first through hole formed therein; a first substrate disposed on an upper end portion of the base substrate and including a second through hole having a diameter smaller than that of the first through hole; and a heat dissipating pad disposed on an upper end portion of the second through hole. In addition, a flow phenomenon of a thermal conduction member (lead) may be reduced using the thermal conduction member by forming a second through hole smaller than a first through hole.