The invention relates to a method for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction.In particular, a magnetic flux is locally induced at a plurality of conducting spacers (25) provided along a peripheral area (22) of the multilayer stack (18).By this method, it is possible to induce magnetic fluxes with opposite sign in individual areas of the peripheral area, thus achieving the maximum energy efficiency during the bonding process.The invention further comprises an induction head and a bonding apparatus for performing the method.