Invention Grant
- Patent Title: Blackplane board and wiring method of backplane board
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Application No.: US14381444Application Date: 2013-03-13
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Publication No.: US09603275B2Publication Date: 2017-03-21
- Inventor: Kazuhiro Kashiwakura
- Applicant: Kazuhiro Kashiwakura
- Applicant Address: JP Tokyo
- Assignee: NEC CORPORATION
- Current Assignee: NEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2012-071412 20120327
- International Application: PCT/JP2013/001630 WO 20130313
- International Announcement: WO2013/145596 WO 20131003
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K7/02 ; H05K7/14 ; G06F1/18 ; H05K3/36 ; H05K1/14
Abstract:
The present invention is a backplane board including a first circuit board, a second circuit board, a first slot in which a first connector is connected with the first circuit board, and a second slot in which a second connector is connected with the second circuit board. The first connector and the second connector are arranged so that pin arrangement of the first connector may be shifted by at least one column in a longitudinal direction against pin arrangement of the second connector.
Public/Granted literature
- US20150131256A1 BLACKPLANE BOARD AND WIRING METHOD OF BACKPLANE BOARD Public/Granted day:2015-05-14
Information query
