An electrical connector for electrically connecting a chip module and a circuit board, includes an insulating body, multiple terminals, and multiple solders. The insulating body includes multiple receiving holes running therethrough and multiple resisting portions. The terminals are respectively located in the receiving holes. One end of each terminal is provided with a soldering portion, the soldering portion has a soldering surface, and the soldering surface is perpendicular to a surface of the circuit board. Left and right sides of the solder urge the soldering surface and the resisting portion respectively, a lower side of the solder is soldered onto the circuit board by reflow soldering, and the solder is soldered to the soldering surface by laser.