Invention Grant
- Patent Title: Carrier head having abrasive structure on retainer ring
-
Application No.: US14105232Application Date: 2013-12-13
-
Publication No.: US09604340B2Publication Date: 2017-03-28
- Inventor: Chang-Sheng Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: B24B37/32
- IPC: B24B37/32 ; B24B53/017 ; B24B53/02
Abstract:
A carrier head includes a housing configured to enclose a wafer and a retainer ring attached to the housing. The retainer ring includes a body and an abrasive structure. The body includes an inner periphery configured to surround the wafer, an outer periphery, and a surface connecting the inner periphery and the outer periphery. The abrasive structure is attached to the surface of the body.
Public/Granted literature
- US20150165587A1 CARRIER HEAD HAVING ABRASIVE STRUCTURE ON RETAINER RING Public/Granted day:2015-06-18
Information query
