Invention Grant
- Patent Title: Liquid ejecting head having support members for supporting circuit board
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Application No.: US15084619Application Date: 2016-03-30
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Publication No.: US09604458B1Publication Date: 2017-03-28
- Inventor: Keita Sugiura , Shohei Koide , Takashi Aiba
- Applicant: Brother Kogyo Kabushiki Kaisha
- Applicant Address: JP Nagoya-shi, Aichi-ken
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya-shi, Aichi-ken
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2015-192742 20150930
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A liquid ejecting head includes: a circuit board extending in a first direction and having a first surface and a second surface opposite the first surface in a second direction perpendicular to the first direction; a main body including head units; wiring members each extending from each head unit toward the circuit board; contacts including a first contact and a second contact connected to corresponding wiring members; a first support member facing the first surface; and a second support member facing the second surface. The first support member has a first protrusion protruding toward the first surface in the second direction and arranged at a position aligned with the second contact in the second direction. The second support member has a second protrusion protruding toward the second surface in the second direction and arranged at a position aligned with the first contact in the second direction.
Public/Granted literature
- US20170087833A1 LIQUID EJECTING HEAD HAVING SUPPORT MEMBERS FOR SUPPORTING CIRCUIT BOARD Public/Granted day:2017-03-30
Information query
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