Invention Grant
- Patent Title: Sequential wafer bonding
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Application No.: US14804110Application Date: 2015-07-20
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Publication No.: US09604844B2Publication Date: 2017-03-28
- Inventor: Philip H. Bowles , Stephen R. Hooper
- Applicant: Philip H. Bowles , Stephen R. Hooper
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Agent Charlene R. Jacobsen
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/04 ; B81B7/00 ; B81C1/00 ; H01L29/66 ; H01L23/10
Abstract:
Embodiments of a sensor device include a sensor substrate and a first cap substrate attached to the sensor substrate with a first bond material. The first bond material is arranged to define a first device cavity. A second cap substrate is attached to the sensor substrate with a second bond material. The second bond material is arranged to define a second device cavity. The second bond material has a lower bonding temperature than the first bond material. The second cap substrate is further secured to the sensor substrate by an adhesive material disposed between the sensor substrate and the second cap substrate.
Public/Granted literature
- US20150321907A1 SEQUENTIAL WAFER BONDING Public/Granted day:2015-11-12
Information query
IPC分类:
