Invention Grant
- Patent Title: Epoxy resin curing agent
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Application No.: US14439757Application Date: 2013-10-21
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Publication No.: US09605110B2Publication Date: 2017-03-28
- Inventor: Shuichi Ueno , Dai Oguro
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2012-241520 20121101; JP2012-241521 20121101
- International Application: PCT/JP2013/078464 WO 20131021
- International Announcement: WO2014/069273 WO 20140508
- Main IPC: C08G59/42
- IPC: C08G59/42 ; C07D307/60 ; C08G59/24 ; C08K5/134
Abstract:
The epoxy resin curing agent of the present invention comprises a compound represented by the following formula (1): wherein R represents a methyl group, an ethyl group, or a hydroxyl group, and n is an integer of 1 to 3.
Public/Granted literature
- US20150291729A1 EPOXY RESIN CURING AGENT Public/Granted day:2015-10-15
Information query
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